| 摘要 |
PURPOSE: To prevent the generation of a short-circuit between leads due to soldering and the generation of a defective solder bonding, which generates adhesion of solder on a circuit board, in the case where electrodes on the circuit board are soldered to the leads of a TAB system using a soldering bit. CONSTITUTION: A solder feeding electrode 4 is provided on a circuit board with copper electrodes 2, which are formed on the circuit board and are bonded to leads 8 of a liquid crystal drive use TAB system, a full solder trap is formed on the bit point part of a soldering bit and a good solder bonding is obtained from a bonding start electrode 1. Moreover, a solder removing electrode 5 is provided on the circuit board, the solder trap on the bit point part is removed and solder bonding free from solder adhesion to the circuit board can be obtained. |
