| 摘要 |
PURPOSE: To securely join a target and a backing plate by subjecting the joint surface of a target material to a substrate treatment by a specific method, then to joining with solder at the time of soldering this target material to the backing plate. CONSTITUTION: The target material consisting of Ti, Ti alloy or Al, Al alloy or the backing plate material consisting of Cu, Cu alloy or Ti or Ti alloy at need is subjected to plating with Ni or Cu at a thickness of 1 to 30μm as the substrate treatment and is then subjected to an ultrasonic metallizing treatment by an Sn-Pb based solder material at the time of joining the target material to the backing plate. Next, the Sn-Pb based solder material is placed on the surface of the backing plate in a vacuum and is heated to melt. Further, the target subjected to a metallizing treatment is placed thereon and after the backing plate and the target are rotated relatively in opposite directions, both are cooled, by which the solder layer of a thickness of 20 to 300μm is formed and the target and the backing plate are securely soldered.
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