| 摘要 |
A high density integrated circuit module which includes a plurality of stacked integrated circuit packages, wherein each package includes a casing, an integrated circuit die disposed within the casing and a plurality of electrical interconnect leads extending from the die through the casing; also including a plurality of electrically and thermally conductive vertical rails. The rails include an upper portion which extends over and is laminated to a spacer, the spacer being disposed on the upper major surface of the uppermost of the integrated circuit packages in the module, a central portion connected to the upper portion, the central portion is electrically and thermally connected to selected ones of the electrical interconnect leads, a spring-bias portion connected to the central portion, the spring-bias portion being curved to provide a spring-bias force on the rails, and a lower portion connected to the spring-bias portion, the lower portion being in surface contact with the lower major surface of the lowermost of the integrated circuit packages in the module.
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