| 摘要 |
After a GaAs substrate is set in a reaction container, the pressure in the reaction container is reduced to 10-100 torr and arsine is supplied into the container. A GaAs buffer layer is formed on the GaAs substrate by introducing TMG when the surface temperature of the GaAs substrate is at 650 DEG C. Then, by stopping supply of TMG, the growth of the GaAs buffer layer is stopped (step I). Arsine is switched to phosphine. A time t after the switching, TMA, TMG and TMI adjusted at a predetermined mixing ratio beforehand are introduced into the container, thereby starting the formation of an InGaAlP layer on the GaAs buffer layer. During the growing process, the surface temperature of the GaAs substrate is raised to 750 DEG C. (step II). The InGaAlP layer is grown to a predetermined thickness with the surface temperature of the GaAs substrate being kept at 750 DEG C. (step III).
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