| 摘要 |
PURPOSE: To obtain a high frequency integrated circuit at a low cost wherein resin does not come into contact with a semiconductor element in a minute cap and a signal line when plastic mold is performed by potting, and the semiconductor element can be protected without deteriorating the electrical characteristics of an integrated circuit. CONSTITUTION: A minute wall 10 is formed on an integrated circuit board 7a so as to surround a semiconductor element 11, stand straight in the direction vertical to the integrated circuit board 7a, and have constant height. A minute cap 15 is arranged so as to hermetically seal the space which is formed by the minute wall 10 and surrounds the semiconductor element. |
