发明名称 WORKING METHOD OF LEAD FRAME, AND LEAD FRAME AND SEMICONDUCTOR DEVICE
摘要 PURPOSE: To easily eliminate dross and spatter while maintaining a fine form of high precision without generating deformation after laser working, in the working method of a lead frame. CONSTITUTION: Both of the surfaces of a metal plate 1 are coated with resist films 2 resistant to electroworking. By laser irradiation, cutting trenches 3 penetrating the metal plate 1 are formed according to the form of a lead frame 100. By electroworking of the metal plate 1 after the laser working, the interface between the metal base and a working denatured layer of the metal plate 1 is selectively corroded (hole corrosion). Thereby not only the dross and spatter which have been a problem but also the working denatured layer 9 containing a resolidification layer, a thermal influence part, etc., formed on the side walls of the cutting trenches 3 are all eliminated. The resist film 2 is finally eliminated.
申请公布号 JPH0870073(A) 申请公布日期 1996.03.12
申请号 JP19940203513 申请日期 1994.08.29
申请人 UNO YOSHIYUKI;HITACHI CONSTR MACH CO LTD 发明人 UNO YOSHIYUKI;TADA NOBUHIKO;OGATA KOJIRO
分类号 B23K26/00;B23K26/16;B23K26/38;H01L23/50 主分类号 B23K26/00
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