发明名称 LEAD FRAME AND MATERIAL FOR LEAD FRAME
摘要 PURPOSE: To provide a lead frame excellent in wear resistance wherein the number of days for manufacturing can be largely reduced as compared with the conventional art because bonding is excellent and a process for tin plating or the like is unnecessary, and material for the lead frame. CONSTITUTION: A silver layer having crystal structure wherein the intensity of a diffracted ray by a (200) face is larger than or equal to 1/3 of the intensity of a diffracted X-ray by a (111) face is formed at least in the outer lead part of lead frame base material. Copper or copper alloy or iron or iron alloy is preferable for the base material. The silver layer is, for example, formed by plating, and the thickness is preferably 8μm-30μm. An intermediate layer may be formed between the surface of the base material and the silver layer.
申请公布号 JPH0870075(A) 申请公布日期 1996.03.12
申请号 JP19940204038 申请日期 1994.08.29
申请人 OMI TADAHIRO;FUJIKIN:KK 发明人 OMI TADAHIRO;IKEDA SHINICHI;YAMAJI MICHIO;SHINOHARA TSUTOMU;MORIMOTO AKIHIRO;SHIRAI YASUYUKI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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