发明名称 HIGH-BREAKDOWN STRENGTH AND HIGH-CURRENT WIRING BOARD
摘要 <p>PURPOSE: To make it possible to absorb the projected amounts error of columnar conductors from a wiring board or an error on the positions of the columnar conductors in the direction of the board surface of the wiring board by a method wherein the depth of a housing space formed in each insulating plate is made deeper than the depth of each high-current use tabular conductor which is housed in this housing space. CONSTITUTION: This high-breakdown strength and high-current wiring board is provided with tabular conductors 1 consisting of a copper plate of a thickness of 3.0mm. Each tabular conductor 1 is one obtainable by forming the copper plate into a necessary circuit pattern by a press punching processing, a water jet cutting processing or the like. A columnar conductor 2 for making continuity in the thickness direction of the wiring board is fixed at a prescribed position on each tabular conductor 1. The tabular conductor 1 is housed in a housing space 13 formed in each insulating plate 4 for housing this conductor 1. The thickness of the plates 4 is 4.0mm. The value of this thickness is a selected value so that the depth of the spaces 13 formed in the plates 4 is formed deeper than the thickness of the conductors 1 provided with an insulating coating layer 3.</p>
申请公布号 JPH0870187(A) 申请公布日期 1996.03.12
申请号 JP19940204764 申请日期 1994.08.30
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOBAYASHI TAKAO;YAMAMOTO MASAAKI;YAJIMA MASAMICHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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