发明名称 |
HIGH-BREAKDOWN STRENGTH AND HIGH-CURRENT WIRING BOARD |
摘要 |
<p>PURPOSE: To make it possible to absorb the projected amounts error of columnar conductors from a wiring board or an error on the positions of the columnar conductors in the direction of the board surface of the wiring board by a method wherein the depth of a housing space formed in each insulating plate is made deeper than the depth of each high-current use tabular conductor which is housed in this housing space. CONSTITUTION: This high-breakdown strength and high-current wiring board is provided with tabular conductors 1 consisting of a copper plate of a thickness of 3.0mm. Each tabular conductor 1 is one obtainable by forming the copper plate into a necessary circuit pattern by a press punching processing, a water jet cutting processing or the like. A columnar conductor 2 for making continuity in the thickness direction of the wiring board is fixed at a prescribed position on each tabular conductor 1. The tabular conductor 1 is housed in a housing space 13 formed in each insulating plate 4 for housing this conductor 1. The thickness of the plates 4 is 4.0mm. The value of this thickness is a selected value so that the depth of the spaces 13 formed in the plates 4 is formed deeper than the thickness of the conductors 1 provided with an insulating coating layer 3.</p> |
申请公布号 |
JPH0870187(A) |
申请公布日期 |
1996.03.12 |
申请号 |
JP19940204764 |
申请日期 |
1994.08.30 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
KOBAYASHI TAKAO;YAMAMOTO MASAAKI;YAJIMA MASAMICHI |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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