发明名称 SUBSTRATE RETENTION TOOL, SUBSTRATE TREATMENT BATH, AND METHOD AND DEVICE FOR WASHING/DRYING SUBSTRATE
摘要 <p>PURPOSE: To provide a substrate retention tool where inconveniences generated due to the retention of a substrate such as liquid accumulation at a groove are solved, the treatment bath of the substrate, and the method and device for washing/drying the substrate for the substrate retention tool used for retaining the substrate and at the same time treating the substrate while retaining the substrate. CONSTITUTION: In a substrate retention tool 2 which retains a substrate 1 and at the same time is used for treating the substrate while the substrate 1 is retained, the substrate 1 is supported so that it can be slid in up/down directions in a direction along the surface and at the same time a support part 3 is provided so that it is subjected to point contact with the substrate and the substrate 1 can be moved up/down (1). A contact part which is subjected to point contact with the substrate is provided in the treatment bath, the substrate retention tool is loaded into the lower part inside the treatment bath while bringing the contact part to the lower portion of the substrate which is retained by the substrate retention tool, thus sliding the substrate relatively in up/down directions at a substrate retention tool in a direction along the surface.</p>
申请公布号 JPH0870031(A) 申请公布日期 1996.03.12
申请号 JP19940203682 申请日期 1994.08.29
申请人 SONY CORP 发明人 KASHIWAGI AKIHIDE
分类号 H01L21/677;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 H01L21/677
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