| 摘要 |
PURPOSE: To provide a semiconductor device which is easily worked from a board material and has a heat sink of specified size. CONSTITUTION: Silver is used for a heat sink 10 for retaining a chip 2. Since the hardness of silver is low, working of silver to the size suitable to the heat sink is easily enabled by pressing. Working from plate material is easy, and a heat sink of specified size can be formed. Although the material cost of silver is higher than that of copper based material, the silver heat sink can be realized without causing cost increase, because the total cost containing working cost can be restrained low. |
