发明名称 |
Interconnection arrangement for power semiconductor switching devices |
摘要 |
A plurality of power semiconductor switching devices are included in a circuit module in a pattern whereby interconnecting lead lengths are minimized to provide improved circuit characteristics and to insure uniform current sharing when said devices are paralleled during switch-on, switch-off and steady state conditions.
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申请公布号 |
US5498907(A) |
申请公布日期 |
1996.03.12 |
申请号 |
US19940304620 |
申请日期 |
1994.09.12 |
申请人 |
ALLIED SIGNAL INC. |
发明人 |
TUMPEY, JOHN J.;SHEKHAWAT, SAMPAT;SILVESTRO, GAYTON L.;BROGLE, JOHN J. |
分类号 |
H01L25/07;(IPC1-7):H01L23/34 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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