| 摘要 |
PURPOSE: To provide a semiconductor device of simple structure which realizes high cooling efficiency of a semiconductor element chip. CONSTITUTION: An insulating film 3 whose thermal conductivity is high is formed on a lead frame 1, and a Peltier effect element 5 is formed on the insulating film 3. An insulating film 4 whose thermal conductivity is higher is formed on the Peltier effect element 5, and an LSI chip 6 is mounted on the insulating film 4. |
