| 摘要 |
PURPOSE: To improve the productivity of a multilayer printed-wiring board by a method wherein a cured undercoating agent is applied to both surfaces of a double-sided copper-clad laminated board subjected to circuit work and after the step of the copper foil of an internal layer circuit ia reduced, an epoxy resin and a guanide compound-containing fast-curing prepreg are laminated and pressed on both surfaces of the interna layer circuit. CONSTITUTION: A heat-cured, light-cured or light-heat combined undercoating agent is applied on both surfaces of an internal layer circuit board and after the step of the copper foil of an internal layer circuit is eliminated or is reduced, an epoxy resin, which has two pieces or more of epoxy groups in one molecule, and a guanide compound-containing fast-curing prepreg are superposed on both surfaces of the internal layer circuit to laminate and are pressed. As the epoxy resin, a bisphenol A is exemplified and as the guanide compound, a 1, 3- diphenylguanidine is exemplified. As the mixing amount of the epoxy resin and the guanide compound, it is desirable that the equivalent amount of the guanide compound is 0.1 to 1.0 equivalent amount to one equivalent amount of the epoxy resin so that amines of one molecule of the guanide compound all participate in a crosslinking reaction. |
