| 摘要 |
PURPOSE: To eliminate inner wiring board, realize a thin light device of high density mounting, and improve reliability of circuit connection. CONSTITUTION: A plurality of various kinds of chip circuit components 2 are arranged so as to expose the electrode surfaces on the bottom surface. In this state, the components are molded and fixed with resin 14. Specified wiring conductors 15, 16 are formed on the bottom surface and in the recessed part formed on the upper surface of the mold resin. A semiconductor chip 18 is fixed to the recessed part and sealed with resin 19. Through hole part 17 is cut out and turned into' an outer connection terminal part. Insulating layers 30 are formed on the upper surface and the bottom surface. |
