发明名称 |
Semiconductor package with weldable ceramic lid |
摘要 |
An integrated circuit package for use in radiation environments includes a base and a lid of insulative materials. The base has a recess for receiving a die and a seal ring located on the periphery. The lid has a central insulation portion and an outwardly extending flange which can be welded to the seal ring.
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申请公布号 |
US5498900(A) |
申请公布日期 |
1996.03.12 |
申请号 |
US19930171958 |
申请日期 |
1993.12.22 |
申请人 |
HONEYWELL INC. |
发明人 |
DUNAWAY, THOMAS J.;SPIELBERGER, RICHARD K. |
分类号 |
H01L23/10;H01L23/552;(IPC1-7):H01L23/552 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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