发明名称 Semiconductor package with weldable ceramic lid
摘要 An integrated circuit package for use in radiation environments includes a base and a lid of insulative materials. The base has a recess for receiving a die and a seal ring located on the periphery. The lid has a central insulation portion and an outwardly extending flange which can be welded to the seal ring.
申请公布号 US5498900(A) 申请公布日期 1996.03.12
申请号 US19930171958 申请日期 1993.12.22
申请人 HONEYWELL INC. 发明人 DUNAWAY, THOMAS J.;SPIELBERGER, RICHARD K.
分类号 H01L23/10;H01L23/552;(IPC1-7):H01L23/552 主分类号 H01L23/10
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