MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

摘要

PURPOSE: To make it possible to bond an internal layer copper foil subjected to copper oxide treatment to a prepreg formed using a phenol curing agent as a curing agent by a good adhesive force. CONSTITUTION: A method of manufacturing a multilayer printed-wiring board, which bonds an internal layer copper foil subjected to copper oxide treatment to a prepreg which is formed by a method, wherein an epoxy resin, a phenol curing agent having two more phenolic hydroxyl groups in one molecule and a phenoxy resin-containing varnish are impregnated in a base material and are dried, is characterized by that the melt viscosity at 130 deg.C of the resin component of the prepreg is 400 to 1500 poises.