| 摘要 |
PURPOSE: To provide a multilayered ceramic package capable of stabilizing characteristics of a microwave integrated circuit device or the like which is constituted in the package, and of miniaturization. CONSTITUTION: A multilayered ceramic package is provided with a base plate 11 wherein an electric circuit is formed on the surface, and a metal film turning to a ground surface is formed on the back, a frame 12 which is arranged on the base plate so as to surround the electric circuit and has a metal film formed on the surface opposite to the base plate, and signal terminals 13a-13d formed on the side surface of the base plate. Through holes 14a-14n are formed on the frame and the base plate, and the metal film on the upper surface of the frame is electrically connected with the metal film on the back of the base plate. |
