发明名称 |
REFRACTORY HEAT INSULATION COMPOSITE PANEL |
摘要 |
PURPOSE: To provide a refractory heat insulation composite panel for controlling the reduction of bonding force between a resol type phenol foam and metal bases generated by the deviation of expansion and contraction by heat and an unreacted material, a remaining material and a reaction product (water) at the time of forming the foam. CONSTITUTION: In a refractory het insulation composite panel in which a resol type pheno foam 1 is interposed integrally between metal bases 2 and 3, a resin film 6 to bond easily with the resol type phenol foam 1 is interposed and formed integrally on the surface of the metal bases 2 and 3 being in contact with the resol type phenol foam 1. |
申请公布号 |
JPH0866982(A) |
申请公布日期 |
1996.03.12 |
申请号 |
JP19940204055 |
申请日期 |
1994.08.30 |
申请人 |
IG TECH RES INC |
发明人 |
OKUYAMA SENICHI;TAKIGUCHI HIDEKI |
分类号 |
E04F13/12;B32B5/18;B32B15/08;B32B27/42;(IPC1-7):B32B5/18 |
主分类号 |
E04F13/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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