发明名称 REFRACTORY HEAT INSULATION COMPOSITE PANEL
摘要 PURPOSE: To provide a refractory heat insulation composite panel for controlling the reduction of bonding force between a resol type phenol foam and metal bases generated by the deviation of expansion and contraction by heat and an unreacted material, a remaining material and a reaction product (water) at the time of forming the foam. CONSTITUTION: In a refractory het insulation composite panel in which a resol type pheno foam 1 is interposed integrally between metal bases 2 and 3, a resin film 6 to bond easily with the resol type phenol foam 1 is interposed and formed integrally on the surface of the metal bases 2 and 3 being in contact with the resol type phenol foam 1.
申请公布号 JPH0866982(A) 申请公布日期 1996.03.12
申请号 JP19940204055 申请日期 1994.08.30
申请人 IG TECH RES INC 发明人 OKUYAMA SENICHI;TAKIGUCHI HIDEKI
分类号 E04F13/12;B32B5/18;B32B15/08;B32B27/42;(IPC1-7):B32B5/18 主分类号 E04F13/12
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