| 摘要 |
<p>PURPOSE: To provide a semiconductor module which has high function in the same volume, by constituting a laminated structure by using a plurality of very thin semiconductor devices of high reliability and low cost which are capable of repair at the time of mounting. CONSTITUTION: A very thin lead frame 1 is directly connected with an LSI chip 2, the back of the LSI chip is exposed, and thin type molding is performed by using low viscosity type epoxy resin 4. The whole of a semiconductor device is farther thinned by grinding the back part. A part of the lead frame is made a reinforcement part 3 or a heat dissipating part or a light shielding part from harmful light or the reference of aligment at the time of board mounting. The above very thin semiconductor devices are connected in a laminated arrangement, and a multilayered semiconductor module is constituted. Thereby a card type module which has higher function is obtained.</p> |
