MANUFACTURE OF MULTILAYER CHIP PART

摘要

PURPOSE: To provide a method for manufacturing a multilayer chip part by which the deterioration of insulating resistance by a plating solution and the occurrence of delamination can be suppressed without generating micro cracks processing strain on the surface of a multilayer chip and the chipping of the chip part can be prevented. CONSTITUTION: By chamfering a divided multilayer chip part before sending the chip part to a binder removing process and baking process, a chipping-free multilayer chip part is obtained without generating any micro crack nor processing strain on the surface of backed chip part.