发明名称 |
Method for fabricating high density ultrasound array |
摘要 |
A high yield method of fabricating an ultrasound array having densely packed ultrasound elements with smooth surface finishes includes the steps of: 1) applying an acoustic matching material to opposites faces (or surfaces) of a piezo electric material ceramic block; 2) cutting the block in a plane perpendicular to the two faces of the block so as to form a plurality of wafers having the acoustic matching material disposed on opposite ends; 3) assembling the wafers to form a laminated body having respective portions of the matching layer on opposite surfaces and with the wafers each being separated from an adjacent wafer by a selected gap distance and bonded together by a polymeric adhesive material; 4) cutting the laminated body along a longitudinal axis so as to form a first laminate body subassembly and a second laminate body subassembly, each of the subassemblies having a front surface having the acoustic matching material disposed thereon and a back surface where the laminate body was cut; 5) applying a backing layer to each laminate body subassembly; and 6) removing the polymeric adhesive material disposed between the wafers, whereby each subassembly comprises an ultrasound array having transducer elements separated by the selected array gap distance.
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申请公布号 |
US5497540(A) |
申请公布日期 |
1996.03.12 |
申请号 |
US19940362338 |
申请日期 |
1994.12.22 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
VENKATARAMANI, SUBRAMANIAM;KWASNICK, ROBERT F.;LORRAINE, PETER W. |
分类号 |
B06B1/06;(IPC1-7):H01L41/22 |
主分类号 |
B06B1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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