发明名称 Method for making an IC lead-frame punch
摘要 A punch for removing material from lead frames has a substantially rectangular body with an array of grooves along one side and a step removed on one end from the side opposite the grooves to provide an array of punch teeth extending from the body of the punch. The grooves provide a means of reworking the punch to provide a new array of teeth, by machining away all or part of the teeth and then extending the step in the direction of the groove to provide substantially the original length for the individual teeth. By providing a punch with groove length several times the tooth length, the punch can be reworked several times before being discarded. Methods for forming the punch and for reworking the punch after breakage or wear are disclosed.
申请公布号 US5497681(A) 申请公布日期 1996.03.12
申请号 US19950435084 申请日期 1995.05.04
申请人 INTEGRATED PACKAGING ASSEMBLY CORPORATION 发明人 ONG, EE-CHANG
分类号 B21D28/34;H01L21/48;(IPC1-7):B21D28/10 主分类号 B21D28/34
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