MULTICHIP MODULE HAVING INTEGRATION TESTING CIRCUIT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To easily test integrated circuit chips and mutually connected wires to electrically joint the integrated circuit chips by providing a semiconductor logic circuit electrically connected to ones of integrated circuits on an interlaid substrate. SOLUTION: Plural integrated circuit chips 12 are arranged to be faced down on an interlaid substrate 14. The interlaid substrate 14 is provide in a cavity in an indicating carrier 16. Wire-bond mutual connections 18 are electrically connected to the inputs/outputs of the integrated circuit chips 12 via plural layers of mutually connecting wires with parts of the interlaid substrate 14. In the interlaid substrate 14, a semiconductor logic circuit is provided which is electrically connected to ones of the integrated circuit chips 12. The logic circuit has a scanning line for a latch such as a multiplexer latch or a shift register latch. The logic circuit is used to easily test a multichip module following the manufacture of the module.