| 摘要 |
PURPOSE: To provide a vacuum chamber for semiconductor processor and manufacturing method thereof capable of minimizing the waste of material by efficiently using the device materials while cutting down the cost of processing device. CONSTITUTION: A vacuum chamber is composed of framed sidewall part 11 junctioned with splitted component members 8, 9, 10 by welding step, a bottom plate 12 and a cover plate 13 bolt-fixed to this sidewall part 11 while the parts abutting agaist the lower and upper surfaces of the sidewall part 11 of the bottom plate 12 and the cover plate 13 are respectively provided with O ring trenches 12c and 13c. |
