发明名称 NEGATIVE TYPE RADIATION-SENSITIVE RESIN COMPOSITION AND ITS PATTERN FORMING METHOD
摘要 PURPOSE: To improve sensitivity, residual film rate, the balance of resolution, heat resistance and dry etching resistance by consisting a resin composition of an alkali soluble resin, a compound causing crosslinking reaction by an acid and a compound generating hydrohalogenic acid by radiation. CONSTITUTION: This resin composition consists of an alkali soluble resin, a compound causing the crosslinking reaction by acid and a compound (acid generating agent by light), which generates hydrohalogenic acid by radiation and expressed by the formula. In the formula, each of X1 -X4 represents hydrogen atom, a lower alkyl group or a halogen atom and at least one of them is a halogen atom. The acid generatipg agent by light expressed by the formula is obtained by dissolving phenolphthalein or cresolphthalein in an alcohol solvent such as methanol, ethanol or a halogen solvent such as dichloromethane, carbon tetrachloride, adding halogen such as chlorine, bromine and allowing to react.
申请公布号 JPH0862833(A) 申请公布日期 1996.03.08
申请号 JP19940218306 申请日期 1994.08.22
申请人 NIPPON KAYAKU CO LTD 发明人 KOYANAGI TAKAO;TAKAHASHI SHINJIRO;KITAORI TOMOYUKI;NAGASAWA KOTARO
分类号 G03F7/004;G03F7/023;G03F7/038;G03F7/30;G03F7/38;H01L21/027 主分类号 G03F7/004
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