| 摘要 |
PURPOSE: To provide a connection method of a chip electronic component wherein short-circuit between electrodes is prevented, an LED elements is miniaturized, its mounting pitch is reduced, high density mounting is enabled, it is excluded for stress to be applied, and reliability can be improved. CONSTITUTION: In the connection method of a chip electronic component, an electronic component(LED element) is preliminarily fixed on an element mounting part of a wiring board 1 by using nonconductive adhesive agent 10, an outer metal electrode 5 of the electronic component 4 is made to approach a metal wiring pattern 2 formed on the wiring board 1, the board 1 and the component 4 are immersed in plating solution containing necessary metal component, and a metal layer 14 is grown by depositing the metal component on the metal wiring pattern by electroplating. |
