| 摘要 |
PURPOSE: To improve the reliability of a miniaturized element electrode by forming the electrically conductive layer of a multilayer structure by more than two kinds of film formation methods. CONSTITUTION: GND and positive electrode layers are formed by baking silver paste on both surfaces of the lead titanate ceramic thin plate of the thickness of 0.1mm and a piezoelectric element is constituted. The acoustic matching layer of the epoxy resin of the thickness of 35μm is adhered on a GND electrode, the back surface load material of the epoxy resin with tungsten filler of the thickness of 300μm and further the substrate of the aluminum of the thickness of 500μm are adhered on a positive electrode and a laminated body is constituted. A notch is worked along the GND and positive electrode layers on the cut surface of the laminated body 31E obtained by cutting the laminated body long and thin to be the width of 0.7mm. The titanium layers 21 and 22 of the thickness of 200nm are adhered to the part of the notch by sputtering, the copper layers 35a and 35b of the thickness of 5μm are adhered by plating further and the pull-out parts of the GND electrode 37 and the positive electrode 36 are formed. Cutting into the thickness of 0.6mm is performed at a cut-off line 19 and a transducer unit is obtained.
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