| 摘要 |
<p>PURPOSE: To provide a resin-sealed semiconductor device and a lead frame with which leads can be inserted easily into the lead holes of a circuit board, the misalignment of a resin package after the lead insertion can be eliminated, the deformations of the leads which are produced when a plurality of semiconductor devices are mounted in a case and, further, the dimension of the resin package in a width direction can be reduced. CONSTITUTION: Recesses 18 are provided between the tip positions, which are the stopper parts, of the outside planes 17A of the widened parts 12 of leads at the outermost positions in a lead arrangement unit 100 and inner lead parts and a tie-bar 15 is connected between the recesses 18.</p> |
