| 摘要 |
PURPOSE: To improve the adhesive property between a casing and epoxy resin by a method wherein the casing of a power module device is formed at least by two upper and lower resin molded articles, and they are fitted, bonded or merely placed. CONSTITUTION: A casing 6a is bonded with silicone adhesive to the metal plate 3 on which a semiconductor chip 1 and an electrode terminal 4 are attached through a ceramic plate 2. Then, silicone gel 7 is injected in the casing 6a, and the silicon gel is hardened by heating it for the prescribed time. Subsequently, after a casing 6b is bonded to the casing 6a with silicone adhesive, epoxy resin 8 is injected in the upper part of the silicone gel 7, and the epoxy resin is hardened by heating for the prescribed time. As a result, the casing 6b and the epoxy resin 8 can be firmly fixed without contaminating the inside surface of the casing 6b by the silicone gel 7. |
