| 摘要 |
PURPOSE: To provide a mounting method and equipment of an electronic component provided with leads wherein assembly lead time is reduced and assembly manhours are rationalized. CONSTITUTION: This equipment is provided with the following: a carrying conveyer 4 for a printed wiring board 3 to a mounting position; a component mounting robot 5 for chucking mounting components 1 and inserting pins into through holes of the board 3 from above; and a soldering robot 6 which mounts a flux pot 7, a dipping solder pot 8, and an air nozzle 9 on a hard part, and moves synchronously with a component mounting robot from the rear side of the printed wiring board to the component mounting position. In the state that the printed wiring board is positioned at the mounting position and retained, the leads of a component provided with leads are inserted into the through holes of the printed wiring board. The tips of the leads protruding on the rear side of the printed wiring board are coated with flux and dipped in solder. Soldering is performed by blowing air. |
