| 摘要 |
<p>PURPOSE: To securely perform the patterning of a conductive thin film with the easier process by utilizing a difference between each adhesiveness of a metal film and a substrate surface and adhesiveness of a metal oxide film and the substrate surface. CONSTITUTION: Element electrodes 4, 5 are formed on a substrate 1. A metal film 21 as the material of a conductive thin film is formed on this substrate 1, and irradiated with the light 23 through a light shielding plate 22 having an opening at a part corresponding to an area to be formed with a conductive thin film, and the metal film of this area is oxidized so as to form a metal oxide film 24. An adhesive tape 25 is attached to the top surface of the substrate 1 so as to adhere the metal film 21 and the metal oxide film 24 with each other, and thereafter, this adhesive tape 25 is peeled. Since adhesiveness of the substrate 1 and the metal film 21 is smaller than the adhesiveness of the substrate 1 and the metal oxide film 24, at the time of peeling the adhesive tape 25 having the appropriate adhesive force, the only metal film 21 can be peeled with the adhesive tape 25. The metal oxide in the desirable pattern is thereby left, and the conductive film 3 is obtained. Continuously, the electrifying processing called forming is performed so as to form an electron discharging part 2.</p> |
