MULTILAYER PRINTED WIRING BOARD,MULTICHIP MODULE BOARD AND MANUFACTURE THEREOF

摘要

PURPOSE: To form a multilayer printed wiring board and a multi-chip module substrate having a layered composite, consisting of high temperature resistant plastic and a metallic conductive path, so that they have an effect of humidity shielding matter. CONSTITUTION: A thin layer consisting of amorphous hydrogen, containing carbon (a-C:H) of water osmotic coefficient (<1.1×19<-13> m<2> /s) is provided to a plastic layer and a c-C:H layer has hardness deviation of hard-soft-hard.