| 摘要 |
PURPOSE: To improve surface roughness of plating and obtain a flat surface, by performing sand blast before upper plating after base plating. CONSTITUTION: The surface of an injection-molded object 3 constituted of a primary injection-molded body 1 and a secondary injection-molded body 2 is subjected to wet treatment. After the treatment, the injection-molded object 3 is dipped in nonelectrolytic copper plating bath. On the surface of compounded resin having a form corresponding with a pattern part 4, base plating (copper plating) 6 is formed to be 20μm thick, as an electric conductor coating film, by using a nonelectrolytic plating method. Sand blast process for mechanically flattening the surface of the base plating 6 by a sand blast method is performed. On the base plating 7 wherein sand blast is finished, upper plating 8 constituted of Cu-plating 10μm thick, Ni-plating 10μm thick, and Au plating 0.3μm thick is continuously formed by using an electrolytic plating method. By heat treatment in a high vacuum or an inert gas atmosphere, a metallized ceramics board can be obtained.
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