SURFACE MOUNT INTEGRATED CIRCUIT STRUCTURE

摘要

PURPOSE: To enhance mounting density and lower profile by arranging two flat packages to achieve a mirrored foot print by using a guide which is positioned inside an attaching opening part. CONSTITUTION: Two flat packages 110 encapsulate an integrated circuit device. An integrated circuit device is connected to a printed circuit board in an S-shape by a lead frame 120 and a soldered connection part 114. A lead is matched properly by a guide 100 inside an opening part and forms a connection part to a vertical flat package 110, which is positioned on a inverted flat package 111, to obtain a mirrored foot print of the lead frame 120. Therefore, since a flat package can be positioned in a printed circuit board according to a mirrored foot print, a simple and inexpensive printed circuit board can be obtained.