发明名称 |
MANUFACTURE OF COPPER CLAD LAMINATED BOARD |
摘要 |
PURPOSE: To prevent rough pieces of a copper foil from being separated from copper foil and being embedded and left within a substrate when forming by using a thin copper foil. CONSTITUTION: Surface-coated zinc is surface-coated with cobalt and molybdenum compounds and copper foil having a surface roughness of Rmax. =2.0 to 7.5μm on the adhering surface is superimposed to a prepreg obtained by impregnating a base material with a thermosetting resin and drying and thereafter heated and pressured.
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申请公布号 |
JPH0864959(A) |
申请公布日期 |
1996.03.08 |
申请号 |
JP19940193904 |
申请日期 |
1994.08.18 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
NARABE YOSHIYUKI;IKEDA KENICHI;SAITO KIYOSHI |
分类号 |
B32B15/08;H05K1/03;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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