发明名称 MANUFACTURE OF COPPER CLAD LAMINATED BOARD
摘要 PURPOSE: To prevent rough pieces of a copper foil from being separated from copper foil and being embedded and left within a substrate when forming by using a thin copper foil. CONSTITUTION: Surface-coated zinc is surface-coated with cobalt and molybdenum compounds and copper foil having a surface roughness of Rmax. =2.0 to 7.5μm on the adhering surface is superimposed to a prepreg obtained by impregnating a base material with a thermosetting resin and drying and thereafter heated and pressured.
申请公布号 JPH0864959(A) 申请公布日期 1996.03.08
申请号 JP19940193904 申请日期 1994.08.18
申请人 HITACHI CHEM CO LTD 发明人 NARABE YOSHIYUKI;IKEDA KENICHI;SAITO KIYOSHI
分类号 B32B15/08;H05K1/03;H05K3/38;(IPC1-7):H05K3/38 主分类号 B32B15/08
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