SEMICONDUCTOR DEVICE AND MANUFACTURE OF INTERCONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device provided with diamond-like carbon as one of a structure as an insulator for separating a conductor of more than one level on an integrated circuit chip. SOLUTION: This semiconductor device is provided with a substrate 12, provided with the first layer 16 of exposed metal on an upper surface 14, an insulator layer 20 of a diamond-like carbon material formed on the upper surface 14 of the substrate 12 and a second layer 22 of a metal patterned, so as to form the plural conductors on the insulation body layer 20.