A data carrier arrangement has a card-shaped carrier element (1) and at least one semiconductor circuit (10...18) integrated on the carrier element. The outer connections of the data carrier arrangement (20...28) have a connecting surface (28) arranged on an edge surface (29) of the carrier element (1). Additional connecting surfaces (30, 32) are preferably provided on the main surfaces (31, 33) of the carrier element (1) to establish an outside connection. When several data carrier arrangements are superimposed so as to register with each other, an electric connection is established in a simple manner between the outer connections of the data carrier arrangements.
