High speed electrochemical metal removal technique for planarization of DLM structure using neutral salt electrolytes

摘要

A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization. <MATH>