Photoresist composition and etching method

摘要

A positive type or negative type photoresist composition for fine processing having excellent resolution, sensitivity, adhesive-ness and developability comprising: (a) an alkali soluble resin or a resin having anti-alkali dissolution groups in the molecules thereof, (b) a light-sensitive compound, and (c) at least one organic compound selected from the group consisting of organic phosphorus acid compounds and esters thereof in an amount of 0.001 to 10% by weight based on a weight of the resin. In addtion, the present invention is directed to an etching method utilizing the positive type or negative type photoresist composition. o