Cover tape for packaging chip type electronic parts

摘要

A cover tape (1) for packaging of chip type electronic parts, which tape comprises an outer layer (2), an intermediate layer (4) and an adhesion layer (5) and which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, the outer layer being a biaxially oriented film (2), the intermediate layer (4) being a polyolefin film which causes its own cohesive failure to enable peeling, and the adhesion layer (5) being a dispersion of conductive fine powders of tin oxide or the like in a thermoplastic resin. In the cover tape (1), the adhesion layer (5) is rendered antistatic by the conductive fine powders.