| 发明名称 |
PROCESS FOR PRE-SOLDERING A CONTACT BASE FOR AN ELECTRIC CIRCUIT COMPONENT AND SEMI-FINISHED PRODUCT FOR USE AS A CONTACT BASE |
| 摘要 |
<p>Method of presoldering the face of a contact piece (10) for electric switch gear consists of using a shaped body (1) with recesses which can accommodate the solder foil (13) and the contact piece (10) as the solder is melted and which does not react or dissolve into the molten solder.</p> |
| 申请公布号 |
EP0617833(B1) |
申请公布日期 |
1996.03.06 |
| 申请号 |
EP19930901601 |
申请日期 |
1992.12.21 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HAUNER, FRANZ;SCHNEIDER, MANFRED |
| 分类号 |
B23K1/002;B23K1/20;B23K35/00;H01H1/02;H01H1/025;H01H11/04;(IPC1-7):H01H1/02 |
主分类号 |
B23K1/002 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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