| 摘要 |
<p>PURPOSE: To take a metallic panel as a guard electrode even if a contact point spring is not put into a card, by a method wherein an uneven part connecting ground potential of a partial mounted circuited board of a metallic substrate and a metallic sheet with each other is formed. CONSTITUTION: On the occasion of molding a metallic sheet frame form of a metallic sheet becoming a basic material by a blanking die, a part which is to become the uneven part is blanked into a form of a cantilever. Then pressed by a bending mold from a vertical direction it is finished into a desirous uneven form. A ground potential pattern 110 plated with Au is formed on a connecting part between an uneven part 109 of a metallic frame 107 and a mounted circuited board 102. An adhesive layer 111 of a connecting part with a metallic panel 108 is removed and when both the connecting parts are connected with each other electrically by the uneven part 109, the metal panel 108 can be made a guard electrode without using contact spring.</p> |
