发明名称 MOLD WITH INSERT MOVING MECHANISM AND BEAD FOAM MOLDING METHOD
摘要 PURPOSE: To provide a mold with an insert moving mechanism and a method for bead foam molding in which no underfill phenomenon occurs even in a foamed molded form with a thick part. CONSTITUTION: A mold for foamable resin bead (a) comprises a lower mold 1 having an insert set pin 31 vertically movable to lock an insert 5, and an upper mold 2 having a push pin 21 fixed the mold surface to stop the upward movement of the pin 31. At the time of filling foamable resin bead (a), the inert 5 disposed at a raised position by the pin 31 is pressed down by the pin 21 at the time of closing the molds, moved down, and disposed.
申请公布号 JPH0857884(A) 申请公布日期 1996.03.05
申请号 JP19940218245 申请日期 1994.08.20
申请人 INOAC CORP 发明人 KAWAKAMI YASUYUKI;YASUGATA NORIHITO;MORITA HARUO
分类号 B29C44/00;B29K105/04;B29K105/20;(IPC1-7):B29C44/00 主分类号 B29C44/00
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