发明名称 Particle contamination apparatus for semiconductor wafer processing
摘要 A semiconductor wafer processing system is disclosed which reduces particle accumulations in the wafer loading chamber during the pump down and vent cycle. A separate venting tube is provided which is positioned within the roughing tube used for the pump-down cycle. The venting tube is isolated from particulate matter which may be present in the roughing tube so that venting gas flow does not cause re-entry of the residual particulate matter into the loading chamber. The venting tube can be easily and inexpensively installed as a particle reduction kit into existing wafer processing systems.
申请公布号 US5496409(A) 申请公布日期 1996.03.05
申请号 US19940276570 申请日期 1994.07.18
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 CHEN, PING I.
分类号 C23C16/44;H01L21/677;(IPC1-7):C23C16/00;C23C14/00;C23F1/02 主分类号 C23C16/44
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