发明名称 |
Particle contamination apparatus for semiconductor wafer processing |
摘要 |
A semiconductor wafer processing system is disclosed which reduces particle accumulations in the wafer loading chamber during the pump down and vent cycle. A separate venting tube is provided which is positioned within the roughing tube used for the pump-down cycle. The venting tube is isolated from particulate matter which may be present in the roughing tube so that venting gas flow does not cause re-entry of the residual particulate matter into the loading chamber. The venting tube can be easily and inexpensively installed as a particle reduction kit into existing wafer processing systems.
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申请公布号 |
US5496409(A) |
申请公布日期 |
1996.03.05 |
申请号 |
US19940276570 |
申请日期 |
1994.07.18 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
CHEN, PING I. |
分类号 |
C23C16/44;H01L21/677;(IPC1-7):C23C16/00;C23C14/00;C23F1/02 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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