| 摘要 |
PURPOSE: To obtain a resin composition having a low dielectric constant, a low dielectric dissipation factor and a sufficient strength, and suitable for electronic parts, especially high-frequency electronic members by compounding a silicate salt fibrous material expressed by a specific formula in a specified ratio. CONSTITUTION: This resin composition is produced by compounding (B) a silicate salt fibrous material of formula V (a, b, c, x, y are real numbers defined by 1 <= a, b <= 6, 0<=c<=10; x=2, y=1, x=y=1, or x=2, y=3; M is a metal element in an amount of 5-60wt.% based on the total weight of the component A and B with (A) a thermoplastic resin composition comprising (i) a polyetherimide of formula I (R<1> group of formula II, etc.; R<2> is ground of formula III, etc.; (m) is 1-1000), (ii) a polyphenylene ether of formula IV (X1 -X4 are each H, methyl; (n) is 1-100), and (iii) an aromatic vinyl resin. The component B is preferably CaO.SiO2 wallastonite containing >=60wt.% of the component having an aspect ratio of >=6 and >=80wt.% of the component having a fiber diameter of <=50μm.
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