| 摘要 |
PURPOSE: To scarcely scatter molten chips of resin at the time of ultrasonic welding by surrounding the welding part of a resin component with a cover before the part is brought into contact with a vibrating member, and conducting the ultrasonic welding. CONSTITUTION: The hole 46 of an opened plate 45 is inserted into the welded part 41 of a resin component 40, the end 23 of a cover 20 is brought into contact with the upper surface of the plate 45, and the part 21 is surrounded by the bore 21 of the cover 20 and the end 12 of a horn 11, thereby limiting the scattering range of the resin layer at the time of welding. Then, the horn 11 is brought into contact with the part 41 to transmit the ultrasonic vibration, the part 41 is melted, and a fusion bonded part 43 is formed by a recess 13. In this case, the resin layer 42 is dropped to the bore 21 of the cover 20, and again melted. The layer 42 melted with the part 41 is formed in the recess 13 formed at the bore 21 of the cover 20 and the end 12 of the horn 11. As a result, a flash, etc., is scarcely generated at the end of the part 43, thereby improving the quality of the part 43. |
