发明名称 |
Composition for treating copper and copper alloy surfaces and method for the surface treatment |
摘要 |
A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
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申请公布号 |
US5496590(A) |
申请公布日期 |
1996.03.05 |
申请号 |
US19940289271 |
申请日期 |
1994.08.11 |
申请人 |
MEC CO., LTD. |
发明人 |
MAKI, YOSHIRO;NAKAGAWA, TOSHIKO;FURUKAWA, YOSHIAKI;OUTANI, MINORU;HARUTA, TAKASHI;YAMANAMI, MAKI;NAKAMURA, SACHIKO |
分类号 |
B23K35/36;C07D235/02;C07D235/08;C07D235/10;C07D235/18;C07D235/20;C23F11/14;H05K3/28;(IPC1-7):B05D3/02;B05D5/12 |
主分类号 |
B23K35/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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