发明名称 |
Planar cable array |
摘要 |
This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact. The array comprises an insulative substrate sheet that has a plurality of parallel conductive lines terminating in a pad over a hole in the substrate.
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申请公布号 |
US5496970(A) |
申请公布日期 |
1996.03.05 |
申请号 |
US19940309375 |
申请日期 |
1994.09.20 |
申请人 |
W. L. GORE & ASSOCIATES, INC. |
发明人 |
SPENCER, MARK S. |
分类号 |
H01R12/08;H01B7/08;H01R12/12;H05K1/02;H05K1/11;H05K3/36;(IPC1-7):H01B7/00;H05K1/00;H01R9/07;H01R13/64 |
主分类号 |
H01R12/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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