| 摘要 |
<p>PURPOSE:To provide a conductive paste excellent in electric conductivity. oxidation resistance, and migration resistance at a low cost, and a product containing the paste. CONSTITUTION:The title compsn. comprises 100 pts.wt. copper alloy powder of the general formula: AgxCuy (wherein 0.001<=x<=0.999, 0.001<=y<=0.999, and x+y=1) wherein the silver content at the surface of the particle of the alloy powder is higher than that in the central part of the particle, 5-200 pts.wt. org. binder, and 0.01-100 pts.wt. additive which can remove copper oxide. The compsn. is used for producing a printed circuit board and as a paste for screen printing, electromagnetic wave shielding, a conductive circuit, a conductive adhesive, an electrode, and through hole coating.</p> |
