| 摘要 |
<p>PURPOSE:To achieve a stable electrical conductivity without any defect in an insulating layer by covering an edge part forming an exposed conduction layer with the exposed conductor layer and by covering the edge part of an insulation paste with a conduction paste forming the exposed conductor layer. CONSTITUTION:While a conduction paste M3 was formed first when forming the conduction paste M3 and an insulation paste Z3 which becomes the outermost layer of simultaneously fired multilayer interconnection board in a conventional technology, this invention allows the paste Z3 to be formed first by reversing the order. As a result, the edge part of the formed insulating layer Z3 is completely covered with the high melting-point metal layer M3 which is the outermost layer. Thus, since a part of the insulating layer Z3 which is not covered with the high melting-point metal layer M3 is relatively thick, the lower high melting-point metal layer cannot be oxidized easily due to defect in the insulating layer Z3 even in the firing process in an oxidation environment of paste for forming a thick film element.</p> |
